”•\“ú | ”•\ŽÒ | ƒ^ƒCƒgƒ‹ | ’˜ŽÒ–¼ | ŽGŽ–¼ | ŠªEƒy[ƒW |
100422 | —„쌚 | ‘²˜_”•\ | | | |
100422 | “n糌‹ˆß | ‘²˜_”•\ | | | |
100422 | ŽÂ“c“Þ | ‘²˜_”•\ | | | |
100506 | ŽÂŒ´•S‡ | X-ray line-broadening analysis of deformation mechanisms during rolling of commercial-purity titanium | M.G. Glavicic, A.A. Salem, S.L. Semiatin | Acta mater | 52(2004)647-655 |
100506 | Wadood | Transformation kinetics and microstructures of Ti17 Titanium alloy during continuous cooling | J. Da Costa Teixeira | Material science and engineering | 448(2007)135-145 |
100506 | “‚‘ò—Sˆ | Enhanced hardening in Cu/330 stainless steel multilayers by nanoscale twinning | X. Zhang | Acta Mater. | 52(2004)995-1002 |
100513 | ‘–ì‘×G | Formation of shear bands and strain-induced martensite during plastic deformation of metastable austenitic stainless steels | J. Talonen | Acta Mater. | 55(2007)6108-6118 |
100513 | ’¾Œ¼•á | Elastic modulus of biomedical titanium alloys by nano-indentation and ultrasonic techniques--A comparative study | P. Majumdar | Materials Science and Engineering A | 489(2007)419-425 |
100513 | Mark | Carbon Dioxide-in-Water Microemulsions | C.T.Lee | J. Am. Chem. Soc. | 125(2003)3181-3189 |
100520 | ’†•½—Dˆê | An analytical model for constitutional supercooling-driven grain formation and grain size prediction | M.Qian,P.Cao | Acta Mater. | 58(2010)3262-3270 |
100520 | –¼‰z‹MŽu | Grain boundary statistics in nano-structured iron produced by high pressure tortion | Yu.Ivanisenko,R.Z.Valiev | Mater. Sci. Eng. | A390(2005)159-165 |
100527 | ]茛‘¾ | Non-Schmid behaviour during secondary twinning in a polycrystalline magnesium alloy | M.R.Barnett,Z.Keshavarz | Acta Mater. | 56(2008)5-15 |
100527 | “cèr˜a | Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds | Rajappa Tadepalli,Kevin T.Turner | Acta Mater. | 56(2008)438-447 |
100527 | ‹g“c“W”V | Effect of pre-existing shear bands on the tensile mechanical properties of a bulk metallic glass | Acta Mater. | 58(2010)1276-1292 | |
100603 | Žá—ÑŒO | | | | |
100603 | ·“c’q•F | Diffusion based model for isothermal solidification kinetics during transient liquid-phase sintering | S.F.Corbin | Metal.Mater.Trans.A | 33A2002 |
100603 | •i“cŠG— | Quantitative microstructure characterization of self-annealed copper films with electron backscatter diffraction | Karen Pantleon,Ali Gholinia | Physica Status Solidi(a) | 205,2(2008)275-281 |
100603 | ‰œ–쌳‹M | Mechanical properties of micro-sized copper bending beams machined by the focused ion beam technique | C.Motz,T.Schoberl, R.Pippan | Acta Materialia | 53(2005)4269-4279 |
100610 | —„쌚 | Analytical modeling of stress-induced martensitic transformation in the crack tip region of nickel-titanium alloys | Carmine Maletta, Franco Furgiuele | Acta Materialia | 58(2010)92-101 |
100610 | “n糌‹ˆß | Correlation between composition and phase transformation temperatures in Ni-Mn-Ga-Co ferromagnetic shape memory alloys | V.Sanchez-Alarcos, J.I.Perez-Landazabal, V.Recarte, C.Gomez-Polo, J.A.Rodriguez-Velamazan | Acta Materialia | 56(2008)5370-5376 |
100610 | ŽÂ“c“Þ | Atomic force microscopic study of polymeric film growth in copper electroplanting bath with benzotriazole | Z.Vivian Fenga, Andrew A. Gewirth | J. Anal. Chem | 601(2007)242-250 |
100617 | ŽÂŒ´•S‡ | Substructure in titanium alloy martensite | D.Banerjee, K.Muraleedharan, J.L.Strudel | Phil.Mag.A | 77(1998)299-323 |
100617 | Wadood | Kinetics of martensite decomposition in Ti-6Al-4V-xH alloys | J.I.Qazi, O.N.Senkov, J.Rahim, F.H.(sam)Froes | Mater. Sci. Eng. A | 359(2003)137-149 |
100617 | “àŽR_в | S.Armini, A.Maestre Caro | S.Armini, A.Maestre Caro | J. Electrochem. Soc | 157(1)D74-D80(2010) |
100617 | ´…“N–ç | Electroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip Connections | Tyler Osborn, Nefertari Galiba, Paul A. Kohl | J. Electrochem. Soc | 156(7)D226-D230(2009) |
100624 | ‘–ì‘×G | Mechanism of deformation and crystal lattice reorientation in strain localization bands and deformation twins of the B2 phase of titanium nickelide | A.N. Tyumentsev, N.S.Surikova, I.Yu.Litovchenko, Yu.P.Pinzhin, A.D.Korotaev, O.V.Lysenko | Acta Materialia | 52(2004)2067-2074 |
100624 | “‚‘ò—Sˆ | Stress relaxation and the structure size-dependence of plastic deformation in nanotwinned copper | Lei Lu, Ting Zhu, Yongfeng Shen, Ming Dao, K.Lu, Subra Suresh | Acta Materialia | 57(2009)5165-5173 |
100701 | ’†•½—Dˆê | A second-order phase-transformation of the dislocation structure during plastic deformation determined by in situ synchrotron X-ray diffraction | E.Schafler, K.Simon, S.Bernstorff, P.Hanak, G.Tichy, T.Ungar, M.J.Zehetbauer | Acta Materialia | 53(2005)315-322 |
100701 | ’¾Œ¼•á | Work-hardening model for polycrystalline metals under strain reversal at large strains | E.F.Rauch, J.J.Gracio, F.Barlat | Acta Materialia | 55(2007)2939-2948 |
100701 | –¼‰z‹MŽu | Microstructure and mechanical properties of super-strong nanocrystalline tungsten processed by high-pressure torsion | Q.Wei, H.T.Zhang, B.E.Schuster, K.T.Ramesh, R.Z.Valiev, L.J.Kecskes, R.J.Dowding, L.Magness, K.Cho | Acta Materialia | 54(2006)4079-4089 |
100701 | ‰œ–쌳‹M | Grain boundary diffusion and recrystallization in ultrafine grain copper produved by equal channel angular pressing | Y.Amouyal, S.V.Divinski, L.Klinger, E.Rabkin | Acta Materialia | 56(2008)5500-5513 |
100708 | ]茛‘¾ | Martensitic transformation in zirconia/Part I.Nanometer scale prediction and measurement of transformation induced relief | Sylvain Deville, Gerard Guenin, Jerome Chevalier | Acta Materialia | 52(2004)5697-5707 |
100708 | Mark | A Mechanistic Model for Copper Electropohishing in Phosphoric Acid | Julie Mendez, Rohan Akolkar, Tatyana Andryushchenko, Uziel Landau | J. Electrochem. Soc | 155(1)D27-D34(2008) |
100708 | “cèr˜a | Evaluation of mechanical interlock effect on adhesion strength of polymer-metal interfaces using micro-patterned surface topography | Won-Seock Kim, Il-Han Yun, Jung-Ju Lee, Hee-Tae Jung | Int J Adhes Adhes | xxx(xxxx)xxx-xxx |
100708 | ‹g“c“W”V | Criteria for tensile plasticity in Cu-Zr-Al bulk metallic glasses | S.Pauly, G.Liu, S.Gorantla, G.Wang, U.Kuhn, D.H.Kim, J.Eckert | Acta Materialia | xxx(2010)xxx-xxx |
100715 | Žá—ÑŒO | Mechanical Properties and Deformation Mechanisms of a Commercially Pure Titanium | S.Nemat-Nasser, W.G.Guo, J.Y.Cheng | Acta Materialia | 47,13,(1999)3705-3720 |
100715 | ·“c’q•F | Modelling the transient liquid phasebonding behaviour of a duplex stainless steel using copper interlayers | T.Padron, T.I.Khan, M.J.Kabir | Mater. Sci. Eng. A | 385(2004)220-228 |
100715 | •i“cŠG— | Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealing | Min-Yuan Cheng, Kei-Wei Chen, Tzeng-Feng Liu, Ying-Lang Wang, Hsien-Ping Feng | Thin Solid Films | --------------- |
”•\“ú |
”•\ŽÒ |
ƒ^ƒCƒgƒ‹ |
’˜ŽÒ–¼ |
ŽGŽ–¼ |
ŠªEƒy[ƒW |
2010/10/14 |
㑺‘׋I |
Mechanical attrition enhanced Ni electroplating |
Zhaohui ning |
Surface & coatings technology |
202(2008)2139-2146 |
2010/10/14 |
Chen |
‘²˜_”•\ |
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2010/10/14 |
Wadood |
Effect of heat treatment and silicon addition on the microstructure development of Ti-6Al-2Cr-2Mo-2Sn-2Zr alloy |
Yuan Xuetao |
Surface & coatings technology |
202(2008)1895-1903 |
2010/10/21 |
’¾Œ¼•á |
Superelastic cycling and room temperature recovery of Ti_74Nb_26 shape memory alloy |
J. Ma |
Acta Materialia |
58(2010)2216-2224 |
2010/10/21 |
Mark |
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2010/10/28 |
‘–ì‘×G |
Direct measurement of the variation in the energy of a dislocation locked in specific orientations |
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2010/10/28 |
“‚‘ò—Cˆ |
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2010/11/04 |
ŽÂŒ´•S‡ |
The decomposition of Ti-Mo alloy martensites by nucleation and growth and spinodal mechanisms |
R.Davis |
Acta Metall |
27(1979)1041-1052 |
2010/11/04 |
“n糌‹ˆß |
The ductility and shape-memory properties of Ni-Mn-Co-Ga |
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2010/11/11 |
´…“N–ç |
Electrochemical atomic layer deposition of copper nanofilms on |
Daniel K.Gebregziabiher |
Journal of Crystal Growth |
312(2010)1271-1276 |
2010/11/11 |
ŽÂ“c“Þ |
Textual and Microstructural Transformation of Cu Damascene Interconnects after Annealing |
Jae-YOUNG CHO |
Journal of ELECtrONIC MATERIALS |
Vol34 No5 (2005)506-514 |
2010/11/16 |
]茛‘¾ |
Strain-temperature behavior of NiTiCu shape memory single crystals |
H. SEHITOGLU |
Acta Materialia |
49(2001)3621-3634 |
2010/11/16 |
·“c’q•F |
On secondary dendrite arm coarsening in peritectic solidification |
D. Ma |
Material science and engineering |
A390(2005)52-62 |
2010/11/16 |
’†•½—Dˆê |
Plastic Instability In Omega Forming Ti-15mol%Mo Alloy |
S. Banerjee |
Acta Materialia |
44(1996)3667-3677 |
2010/11/18 |
Žá—ÑŒO |
On the multiplication of dislocations during martensitic transformations in NiTi shape memory alloys |
T. Simon |
Acta Materialia |
58(2010)1850-1860 |
2010/11/18 |
•i“cŠG—¢ |
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature |
J. M. E. Harper |
Journal of applied physics |
86(1999)2516-2525 |
2010/11/18 |
‰œ–쌳‹M |
Martensitic and Magnetic Transformation Behaviors and NiCoMnIn Metamagnetic shape memory alloys |
W. ITO |
Metallurgical and materials transactions A |
38(2007)759-766 |
2010/11/25 |
‹g“c“W”V |
Influence of similar atom substitution on glass formation in (La-Ce)-Al-Co bulk metallic glasses |
Ran Li |
Acta Materialia |
55(2007)3719-3726 |
2010/11/25 |
“cèr˜a |
Tensile, bending and shear strength distributions of adhesive-bonded butt joint specimens |
Do Won Seo |
Composites science and technology |
65(2005)1421-1427 |
2010/11/25 |
—„쌚 |
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2010/12/02 |
Wadood |
Age-hardening behavior of two metastable beta-titanium alloys |
H.P. Ng |
Material science and engineering A |
527(2010)7017-7026 |
2010/12/02 |
㑺‘׋I |
Electrodeposition of copper : the nucleation mechanisms |
Darko Grujicic |
Electrochimica Acta |
47(2002)2901-2912 |
2010/12/02 |
Chen |
Solid-liquid interface morphology and crystal growth of NiMnGa magnetic shape memory alloys |
Chengbao Jiang |
Acta Materialia |
53(2005)1111-1120 |
2010/12/09 |
‘–ì‘×G |
Thermal activation process of tensile deformation in ƒÁ-TiAl alloy |
Dongliang Lin |
Materials Science and Engineering A |
(1997)369-377 |
2010/12/09 |
Mark |
Through-Hole Filling by Copper Electroplating |
Wei-Ping Dow |
Journal of the Electrochemical Society |
155(2008)D750-D757 |
2010/12/16 |
ŽÂŒ´•S‡ |
Three-dimensional analysis of microstructures in titanium |
Hemant Sharma |
Acta Materialia |
58(2010)2399-2407 |
2010/12/16 |
’¾Œ¼•á |
Martensitic transformation of a Ti-rich Ti_40.5-Ni_49.5-Zr_10 shape memory alloy |
S.K. Wu |
Journal of alloys and compounds |
297(2000)294-302 |
2010/12/16 |
–¼‰z‹MŽu |
FIB damage of Cu and possible consequences for miniaturized mechanical tests |
D. Kiener |
Materials Science and Engineering A |
459(2007)262-272 |
2010/12/16 |
“‚‘ò—Cˆ |
Microstructural evolution and strain hardening of Fe-24Mn and Fe-30Mn alloys during tensile deformation |
X. Liang |
Acta Materialia |
57(2009)3978-3988 |
2010/12/21 |
—„쌚 |
In situ SEM-EBSD observations of the hcp to bcc phase |
G.G.E.Seward |
Acta Materialia |
52(2004)821-832 |
2010/12/21 |
“n糌‹ˆß |
Effect of magnetic field on martensite transformation in a polycrystalline Ni_2MnGa |
Soonjong Jeong |
Materials Science and Engineering A |
359(2003)253-260 |
2010/12/21 |
ŽÂ“c“Þ |
A study on seed damage in plating electrolyte and its repairing in Cu damascene metallization |
Sung Ki Cho |
Journal of the Electrochemical Society |
157(2010)D187-D192 |