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100422—„쌚‘²˜_”­•\   
100422“n糌‹ˆß‘²˜_”­•\   
100422ŽÂ“c“Þ‘²˜_”­•\   
100506ŽÂŒ´•S‡X-ray line-broadening analysis of deformation mechanisms during rolling of commercial-purity titaniumM.G. Glavicic, A.A. Salem, S.L. SemiatinActa mater52(2004)647-655
100506WadoodTransformation kinetics and microstructures of Ti17 Titanium alloy during continuous coolingJ. Da Costa TeixeiraMaterial science and engineering448(2007)135-145
100506“‚‘ò—SˆEnhanced hardening in Cu/330 stainless steel multilayers by nanoscale twinningX. ZhangActa Mater.52(2004)995-1002
100513‘–ì‘×GFormation of shear bands and strain-induced martensite during plastic deformation of metastable austenitic stainless steelsJ. TalonenActa Mater.55(2007)6108-6118
100513’¾Œ¼•áElastic modulus of biomedical titanium alloys by nano-indentation and ultrasonic techniques--A comparative studyP. MajumdarMaterials Science and Engineering A489(2007)419-425
100513MarkCarbon Dioxide-in-Water MicroemulsionsC.T.LeeJ. Am. Chem. Soc.125(2003)3181-3189
100520’†•½—DˆêAn analytical model for constitutional supercooling-driven grain formation and grain size predictionM.Qian,P.CaoActa Mater.58(2010)3262-3270
100520–¼‰z‹MŽuGrain boundary statistics in nano-structured iron produced by high pressure tortionYu.Ivanisenko,R.Z.ValievMater. Sci. Eng.A390(2005)159-165
100527]茛‘¾Non-Schmid behaviour during secondary twinning in a polycrystalline magnesium alloyM.R.Barnett,Z.KeshavarzActa Mater.56(2008)5-15
100527“cèr˜aEffects of patterning on the interface toughness of wafer-level Cu-Cu bondsRajappa Tadepalli,Kevin T.TurnerActa Mater.56(2008)438-447
100527‹g“c“W”VEffect of pre-existing shear bands on the tensile mechanical properties of a bulk metallic glassActa Mater.58(2010)1276-1292 
100603Žá—ÑŒO   
100603·“c’q•FDiffusion based model for isothermal solidification kinetics during transient liquid-phase sinteringS.F.CorbinMetal.Mater.Trans.A33A2002
100603•i“cŠG—Quantitative microstructure characterization of self-annealed copper films with electron backscatter diffractionKaren Pantleon,Ali GholiniaPhysica Status Solidi(a)205,2(2008)275-281
100603‰œ–쌳‹MMechanical properties of micro-sized copper bending beams machined by the focused ion beam techniqueC.Motz,T.Schoberl, R.PippanActa Materialia53(2005)4269-4279
100610—„쌚Analytical modeling of stress-induced martensitic transformation in the crack tip region of nickel-titanium alloysCarmine Maletta, Franco FurgiueleActa Materialia58(2010)92-101
100610“n糌‹ˆßCorrelation between composition and phase transformation temperatures in Ni-Mn-Ga-Co ferromagnetic shape memory alloysV.Sanchez-Alarcos, J.I.Perez-Landazabal, V.Recarte, C.Gomez-Polo, J.A.Rodriguez-VelamazanActa Materialia56(2008)5370-5376
100610ŽÂ“c“ÞAtomic force microscopic study of polymeric film growth in copper electroplanting bath with benzotriazoleZ.Vivian Fenga, Andrew A. GewirthJ. Anal. Chem601(2007)242-250
100617ŽÂŒ´•S‡Substructure in titanium alloy martensiteD.Banerjee, K.Muraleedharan, J.L.StrudelPhil.Mag.A77(1998)299-323
100617WadoodKinetics of martensite decomposition in Ti-6Al-4V-xH alloysJ.I.Qazi, O.N.Senkov, J.Rahim, F.H.(sam)FroesMater. Sci. Eng. A359(2003)137-149
100617“àŽR_вS.Armini, A.Maestre CaroS.Armini, A.Maestre CaroJ. Electrochem. Soc157(1)D74-D80(2010)
100617´…“N–çElectroless Copper Deposition with PEG Suppression for All-Copper Flip-Chip ConnectionsTyler Osborn, Nefertari Galiba, Paul A. KohlJ. Electrochem. Soc156(7)D226-D230(2009)
100624‘–ì‘×GMechanism of deformation and crystal lattice reorientation in strain localization bands and deformation twins of the B2 phase of titanium nickelideA.N. Tyumentsev, N.S.Surikova, I.Yu.Litovchenko, Yu.P.Pinzhin, A.D.Korotaev, O.V.LysenkoActa Materialia52(2004)2067-2074
100624“‚‘ò—SˆStress relaxation and the structure size-dependence of plastic deformation in nanotwinned copperLei Lu, Ting Zhu, Yongfeng Shen, Ming Dao, K.Lu, Subra SureshActa Materialia57(2009)5165-5173
100701’†•½—DˆêA second-order phase-transformation of the dislocation structure during plastic deformation determined by in situ synchrotron X-ray diffractionE.Schafler, K.Simon, S.Bernstorff, P.Hanak, G.Tichy, T.Ungar, M.J.ZehetbauerActa Materialia53(2005)315-322
100701’¾Œ¼•áWork-hardening model for polycrystalline metals under strain reversal at large strainsE.F.Rauch, J.J.Gracio, F.BarlatActa Materialia55(2007)2939-2948
100701–¼‰z‹MŽuMicrostructure and mechanical properties of super-strong nanocrystalline tungsten processed by high-pressure torsionQ.Wei, H.T.Zhang, B.E.Schuster, K.T.Ramesh, R.Z.Valiev, L.J.Kecskes, R.J.Dowding, L.Magness, K.ChoActa Materialia54(2006)4079-4089
100701‰œ–쌳‹MGrain boundary diffusion and recrystallization in ultrafine grain copper produved by equal channel angular pressingY.Amouyal, S.V.Divinski, L.Klinger, E.RabkinActa Materialia56(2008)5500-5513
100708]茛‘¾Martensitic transformation in zirconia/Part I.Nanometer scale prediction and measurement of transformation induced reliefSylvain Deville, Gerard Guenin, Jerome ChevalierActa Materialia52(2004)5697-5707
100708MarkA Mechanistic Model for Copper Electropohishing in Phosphoric AcidJulie Mendez, Rohan Akolkar, Tatyana Andryushchenko, Uziel LandauJ. Electrochem. Soc155(1)D27-D34(2008)
100708“cèr˜aEvaluation of mechanical interlock effect on adhesion strength of polymer-metal interfaces using micro-patterned surface topographyWon-Seock Kim, Il-Han Yun, Jung-Ju Lee, Hee-Tae JungInt J Adhes Adhesxxx(xxxx)xxx-xxx
100708‹g“c“W”VCriteria for tensile plasticity in Cu-Zr-Al bulk metallic glassesS.Pauly, G.Liu, S.Gorantla, G.Wang, U.Kuhn, D.H.Kim, J.EckertActa Materialiaxxx(2010)xxx-xxx
100715Žá—ÑŒOMechanical Properties and Deformation Mechanisms of a Commercially Pure TitaniumS.Nemat-Nasser, W.G.Guo, J.Y.ChengActa Materialia47,13,(1999)3705-3720
100715·“c’q•FModelling the transient liquid phasebonding behaviour of a duplex stainless steel using copper interlayersT.Padron, T.I.Khan, M.J.KabirMater. Sci. Eng. A385(2004)220-228
100715•i“cŠG—Effects of direct current and pulse-reverse copper plating waveforms on the incubation behavior of self-annealingMin-Yuan Cheng, Kei-Wei Chen, Tzeng-Feng Liu, Ying-Lang Wang, Hsien-Ping FengThin Solid Films---------------

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”­•\“ú ”­•\ŽÒ ƒ^ƒCƒgƒ‹ ’˜ŽÒ–¼ ŽGŽ–¼ ŠªEƒy[ƒW
2010/10/14 㑺‘׋I Mechanical attrition enhanced Ni electroplating Zhaohui ning Surface & coatings technology 202(2008)2139-2146
2010/10/14 Chen ‘²˜_”­•\
2010/10/14 Wadood Effect of heat treatment and silicon addition on the microstructure development of Ti-6Al-2Cr-2Mo-2Sn-2Zr alloy Yuan Xuetao Surface & coatings technology 202(2008)1895-1903
2010/10/21 ’¾Œ¼•á Superelastic cycling and room temperature recovery of Ti_74Nb_26 shape memory alloy J. Ma Acta Materialia 58(2010)2216-2224
2010/10/21 Mark
2010/10/28 ‘–ì‘×G Direct measurement of the variation in the energy of a dislocation locked in specific orientations
2010/10/28 “‚‘ò—Cˆ
2010/11/04 ŽÂŒ´•S‡ The decomposition of Ti-Mo alloy martensites by nucleation and growth and spinodal mechanisms R.Davis Acta Metall 27(1979)1041-1052
2010/11/04 “n糌‹ˆß The ductility and shape-memory properties of Ni-Mn-Co-Ga
2010/11/11 ´…“N–ç Electrochemical atomic layer deposition of copper nanofilms on Daniel K.Gebregziabiher Journal of Crystal Growth 312(2010)1271-1276
2010/11/11 ŽÂ“c“Þ Textual and Microstructural Transformation of Cu Damascene Interconnects after Annealing Jae-YOUNG CHO Journal of ELECtrONIC MATERIALS Vol34 No5 (2005)506-514
2010/11/16 ]茛‘¾ Strain-temperature behavior of NiTiCu shape memory single crystals H. SEHITOGLU Acta Materialia 49(2001)3621-3634
2010/11/16 ·“c’q•F On secondary dendrite arm coarsening in peritectic solidification D. Ma Material science and engineering A390(2005)52-62
2010/11/16 ’†•½—Dˆê Plastic Instability In Omega Forming Ti-15mol%Mo Alloy S. Banerjee Acta Materialia 44(1996)3667-3677
2010/11/18 Žá—ÑŒO On the multiplication of dislocations during martensitic transformations in NiTi shape memory alloys T. Simon Acta Materialia 58(2010)1850-1860
2010/11/18 •i“cŠG—¢ Mechanisms for microstructure evolution in electroplated copper thin films near room temperature J. M. E. Harper Journal of applied physics 86(1999)2516-2525
2010/11/18 ‰œ–쌳‹M Martensitic and Magnetic Transformation Behaviors and NiCoMnIn Metamagnetic shape memory alloys W. ITO Metallurgical and materials transactions A 38(2007)759-766
2010/11/25 ‹g“c“W”V Influence of similar atom substitution on glass formation in (La-Ce)-Al-Co bulk metallic glasses Ran Li Acta Materialia 55(2007)3719-3726
2010/11/25 “cèr˜a Tensile, bending and shear strength distributions of adhesive-bonded butt joint specimens Do Won Seo Composites science and technology 65(2005)1421-1427
2010/11/25 —„쌚
2010/12/02 Wadood Age-hardening behavior of two metastable beta-titanium alloys H.P. Ng Material science and engineering A 527(2010)7017-7026
2010/12/02 㑺‘׋I Electrodeposition of copper : the nucleation mechanisms Darko Grujicic Electrochimica Acta 47(2002)2901-2912
2010/12/02 Chen Solid-liquid interface morphology and crystal growth of NiMnGa magnetic shape memory alloys Chengbao Jiang Acta Materialia 53(2005)1111-1120
2010/12/09 ‘–ì‘×G Thermal activation process of tensile deformation in ƒÁ-TiAl alloy Dongliang Lin Materials Science and Engineering A (1997)369-377
2010/12/09 Mark Through-Hole Filling by Copper Electroplating Wei-Ping Dow Journal of the Electrochemical Society 155(2008)D750-D757
2010/12/16 ŽÂŒ´•S‡ Three-dimensional analysis of microstructures in titanium Hemant Sharma Acta Materialia 58(2010)2399-2407
2010/12/16 ’¾Œ¼•á Martensitic transformation of a Ti-rich Ti_40.5-Ni_49.5-Zr_10 shape memory alloy S.K. Wu Journal of alloys and compounds 297(2000)294-302
2010/12/16 –¼‰z‹MŽu FIB damage of Cu and possible consequences for miniaturized mechanical tests D. Kiener Materials Science and Engineering A 459(2007)262-272
2010/12/16 “‚‘ò—Cˆ Microstructural evolution and strain hardening of Fe-24Mn and Fe-30Mn alloys during tensile deformation X. Liang Acta Materialia 57(2009)3978-3988
2010/12/21 —„쌚 In situ SEM-EBSD observations of the hcp to bcc phase G.G.E.Seward Acta Materialia 52(2004)821-832
2010/12/21 “n糌‹ˆß Effect of magnetic field on martensite transformation in a polycrystalline Ni_2MnGa Soonjong Jeong Materials Science and Engineering A 359(2003)253-260
2010/12/21 ŽÂ“c“Þ A study on seed damage in plating electrolyte and its repairing in Cu damascene metallization Sung Ki Cho Journal of the Electrochemical Society 157(2010)D187-D192