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090514‰œ–쌳‹MA 1% magnetostrain in polycrystalline 5M Ni-Mn-Ga Acta Materialia57(2009)365-370
090514’†•½—DˆêOn the mechanism of superelasticity in Gum metal Acta Materialia57(2009)1188-1198
090521’ç‘� Stability of martensite in noble metal alloys Materials Science and EngineeringA349(2003)120-131
090521Œã“¡�Í�mDifferent modeling concepts of magnetic shape memory and their comparison with some experimental results obtained in Ni-Mn-Ga Materials Science and EngineeringA378(2004)513-518
090521‘�–ì‘×�GEnhanced superplasticity utilizing dynamic globularization of Ti-6Al-4V alloy Materials Science and EngineeringA496(2008)150-158
090528‹g“c“W”VSize-indipendent strength and deformation mode in compression of a Pd-based metallic glass Acta Materialia56(2008)5091-5100
090528�·“c’q•FZonal dislocation mediating {1 0 -1 1}<1 0 -1 -2> twinning in magnesium Acta Materialia57(2009)1734-1743
090528•i“cŠG—�Studies of the driving force for room-temperature microstructure evolution J. Vac. Sci. Technol.B22(5), Sep/Oct 2004
090604–¼‰z‹MŽuIncreasing the ductility of nanostructured Al and Fe by deformation Materials Science and EngineeringA493(2008)184-189
090604�]�茛‘¾Martensitic transitions and mechanical spectroscopy of Ni_50.8 Ti_49.2 alloy containing hydrogen Acta Materialia47(1999)4525-4533
090604“c�è�r˜aThe effects of plasticity on adhesion of hard films on ductile interlayers Acta Materialia53(2005)2555-2562
090618‰œ–쌳‹MDirect observation of AC field-induced twin-boundary dynamics in bulk NiMnGa Acta Materialia56(2008)5130-5137
090618’†•½—DˆêOn the activation of recrystallization nucleation in Fe and Cu Materials Science and EngineeringA502(2009)70-78
090618WADOOD Characterization of bioactive surface oxidation layer on NiTi alloy Applied Surface Science252(2005)2038-2049
090625’ç‘� Fatigue behavior of Cu-Al-Be shape memory single crystals Materials Science and EngineeringA290(2000)171-179
090625Œã“¡�Í�mThe thermodynamics of and strengthening due to co-clusters: General theory and application to the case of Al-Cu-Mg alloys Acta Materialia57(2009)2376-2389
090625�´�…“N–çCopper electroplating to fill blind vias for three-dimensional integration J. Vac. Sci. Technol.A24(4), Jul/Aug 2006
090709“àŽR�_вDefect-Free Copper Filling Using Nonisothermal Electroless Deposition with Fluorocarbon Surfactant Journal of The Electrochemical Society155(12)D791-D797(2008)
090709‘�–ì‘×�GGrain size and orientation distributions: Application to yielding of ƒ¿-titanium Acta Materialia57(2009)2339-2348
090709Woo byung hoonConfocal microscopy analysis of supercritical fluid impregnation of polypropylene Ind. Eng. Chem. Res.2002, 41, 1780-1786

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091015’¾Œ¼•áN/A---
091015’†•½—DˆêStrain rate sensitivity of thermally activated dislocation motion across fields of obstacles of different kindR.C. Picu, Renge Li, Zhijie XuMaterials Science and EngineeringA502(2009)164-171
091015WadoodShape-memory NiTi foams produced by replication of NaCl space-holdersA. Bansiddhi, D.C. DunandActa Biomaterialia4(2008)1996-2007
091029‘�–ì‘×�GSerrated flow behavior in a near alpha titanium alloy IMI834Kartik Prasad, Vijay.K. VarmaMaterials Science and EngineeringA486(2008)158-166
091029�·“c’q•FAnalytical modeling of transient liquid phase (TLP) diffusion bonding when a temperature gradient is imposedA.A. Shirzadi, E.R. WallachActa MaterialiaVol.47 No.13(1999)3551-3560
091029‹g“c“W”VFormation, microstructure and properties of long-period order structure reinforced Mg-based bulk metallic glass compositesX. Hui, W. Dong, G.L. Chen, K.F. YaoActa Materialia55(2007)907-920
091105‰œ–쌳‹MSelf-diffusion in Ni_2MnGaG. Erdélyi, H. Mehrer, A.W. Imre, T.A. Lograsso, D.L. SchlagelIntermetallics15(2007)1078-1083
091105�]�茛‘¾Microstructural investigation of the volume beneath nanoindentations in copperM. Rester, C. Motz, R. PippanActa Materialia55(2007)6427-6435
091105–¼‰z‹MŽuEffect of grain orientation on deformation structure in cold-rolled polycrystalline aluminiumQ.LIU, D.JUUL JENSEN, N.HANSENActa MaterialiaVol.46, Issue 16(1998)5819-5838
091112•i“cŠG—¢Influence of initial microstructure and impurities on Cu room-temperature recrystallization (self-annealing)M. Stangl, M. Lipta�Lk, A. Fletcher, J. Acker, J. Thomas, H. Wendrock, S. Oswald, K. WetzigMicroelectronic Engineering85(2008)534–541
091112“c�è�r˜aSome critical experiments on the strain-rate sensitivity of nanocrystalline nickelR. Schwaiger, B. Moser, M. Dao, N. Chollacoop and S. SureshActa Materialia51(2003)5159–5172
091112“‚‘ò—C�ˆObservation of twin boundary migration in copper during deformationD.P. Field, B.W. True, T.M. Lillo, J.E. FlinnMaterials Science and EngineeringA372(2004)173–179
091112Mark Chang----
091117’ç‘�Combinatorial studies of mechanical properties of Ti-Al thin films using nanoidentationSeung Min Han,R.Shah,R.BenerjeeActa Materialia53(2005)2059-2067
091117Œã“¡�Í�mDeformation and annealing of (001)[01-1]oriented Al single crystalsN.Stanford,D.Dunne,M.FerryActa Materialia51(2003)665-676
091117’¾Œ¼•áA simple dislocation model of deformation resistance of ultrafine-grain materials explaining Hall-Petch�@strengthening and enhanced strain rate sensitivityW.Blun,X.H.ZengActa Materialia57(2009)1966-1974
091124Abdul WadoodAging response of coarse and fine grained beta(ƒÀ)titanium alloysO.M.Ivasishin,P.E.Markovsky S.L.SemiatinMaterial science and engineering405(2005)296-305
091124�·“c’q•FTransient liquid phase diffusion bonding under a temperature gradient:Modeling of the interface morphologyAssadi .H,Shirzadi A.A and Wallach.E.RActa Materialia49(2001)31-39
091124‹g“c“W”VIn situ formed two-phase metallic glass with surface fractal microstructureA.A.Kunding,M.Ohnuma,D.H.Ping,T.Ohnuki,K.HonoActa Materialia52(2004)2441-2448
091203‰œ–쌳‹MDeformation twinnning in NiMnGa micropillars with 10M martensiteM.Reinhold,D.Kiener,W.B.Knowlton,G.Dehm,P.MullnerJournal of Applied Physics106(2009)053906,1-6
091203�]�茛‘¾Tempering effects on three martensitic carbon steels studies by mechanical spectroscopyR.Martin,I.Tkalces,D.Mari and R.SchallerPhilosophical Magazine vol88,No.22(2008),2907-2920
091203–¼‰z‹MŽuExperimentally determined content of s geometrically necessary dislocation boundary in copperRodney J,Mccabe,Amit Misra,Terence E.MitchellActa Materialia53(2003)705-714
091210•i“cŠG—¢Recrystallization kinettics of electroplated Cu in damascence trencches at room temperatureC.Lingk and M.E.GrossJournal of Applied Physics84(1998)
091210“c�è�r˜aSize-effected single-slip behavior of pure nickel microcrystalaD.M.Dimiduk,M.D.Uchic,T.A.ParthasaranthyActa Materialia53(2005)4065-4077
091217“‚‘ò—S�ˆNano-sized twin induced high rate sensitivity of flow stress in pure copperL.Liu,R.Schwaiger,Z.W.Shan,M.Dao,K.Lu,S,SureshActa Materialia53(2005)2169-2179
091217“àŽR�_вLocalized electroless deposition of gold nanoparticles using scanning electrochemical microscopyE.Malel and D.MandlerJournal of the electrochemical society(2008)155(6),D459-D467
091217Mark ChangVertically oriented TiO2 nanotube arrays growth on Ti meshes for flexible Dye-Sensitized solar cellsZhaoyue Liu,Vaidyanathan Subramania,and Mano MasraJournal of Phisical Chemistry C113(2009)14028-14003
091217�´�…“N–çPlanarization efficiency of electrochemical mechanical deposition and its dependence on process parameterBulent M.Basqol,Serkan Erdemli,Cyprian E.Uzoh,and Tony WangJournal of electrochemical society153(3)C176-C181(2006)
100114’¾Œ¼•áPlastic deformation anfd fracture of ultrafine-grained Al-Mg alooys with a bimodal grain size distributionG.J Fan H.Choo,P.K.Liaw,E.J LaverniaActa Materialia54(2006)1759-1766
100114’†•½—DˆêSolute strengthening of both mobile and forest dislocation:The orgin of dynamic strain aging of fccM.A.Soare,W.A.CurtinActa Materialia56(2008)4046-4061