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090514‰œ–쌳‹MA 1% magnetostrain in polycrystalline 5M Ni-Mn-Ga Acta Materialia57(2009)365-370
090514’†•½—DˆêOn the mechanism of superelasticity in Gum metal Acta Materialia57(2009)1188-1198
090521’ç‘ Stability of martensite in noble metal alloys Materials Science and EngineeringA349(2003)120-131
090521Œã“¡ÍmDifferent modeling concepts of magnetic shape memory and their comparison with some experimental results obtained in Ni-Mn-Ga Materials Science and EngineeringA378(2004)513-518
090521‘–ì‘×GEnhanced superplasticity utilizing dynamic globularization of Ti-6Al-4V alloy Materials Science and EngineeringA496(2008)150-158
090528‹g“c“W”VSize-indipendent strength and deformation mode in compression of a Pd-based metallic glass Acta Materialia56(2008)5091-5100
090528·“c’q•FZonal dislocation mediating {1 0 -1 1}<1 0 -1 -2> twinning in magnesium Acta Materialia57(2009)1734-1743
090528•i“cŠG—Studies of the driving force for room-temperature microstructure evolution J. Vac. Sci. Technol.B22(5), Sep/Oct 2004
090604–¼‰z‹MŽuIncreasing the ductility of nanostructured Al and Fe by deformation Materials Science and EngineeringA493(2008)184-189
090604]茛‘¾Martensitic transitions and mechanical spectroscopy of Ni_50.8 Ti_49.2 alloy containing hydrogen Acta Materialia47(1999)4525-4533
090604“cèr˜aThe effects of plasticity on adhesion of hard films on ductile interlayers Acta Materialia53(2005)2555-2562
090618‰œ–쌳‹MDirect observation of AC field-induced twin-boundary dynamics in bulk NiMnGa Acta Materialia56(2008)5130-5137
090618’†•½—DˆêOn the activation of recrystallization nucleation in Fe and Cu Materials Science and EngineeringA502(2009)70-78
090618WADOOD Characterization of bioactive surface oxidation layer on NiTi alloy Applied Surface Science252(2005)2038-2049
090625’ç‘ Fatigue behavior of Cu-Al-Be shape memory single crystals Materials Science and EngineeringA290(2000)171-179
090625Œã“¡ÍmThe thermodynamics of and strengthening due to co-clusters: General theory and application to the case of Al-Cu-Mg alloys Acta Materialia57(2009)2376-2389
090625´…“N–çCopper electroplating to fill blind vias for three-dimensional integration J. Vac. Sci. Technol.A24(4), Jul/Aug 2006
090709“àŽR_вDefect-Free Copper Filling Using Nonisothermal Electroless Deposition with Fluorocarbon Surfactant Journal of The Electrochemical Society155(12)D791-D797(2008)
090709‘–ì‘×GGrain size and orientation distributions: Application to yielding of ƒ¿-titanium Acta Materialia57(2009)2339-2348
090709Woo byung hoonConfocal microscopy analysis of supercritical fluid impregnation of polypropylene Ind. Eng. Chem. Res.2002, 41, 1780-1786

ŒãŠú

”­•\“ú”­•\ŽÒƒ^ƒCƒgƒ‹’˜ŽÒ–¼ŽGŽ–¼ŠªEƒy[ƒW
091015’¾Œ¼•áN/A---
091015’†•½—DˆêStrain rate sensitivity of thermally activated dislocation motion across fields of obstacles of different kindR.C. Picu, Renge Li, Zhijie XuMaterials Science and EngineeringA502(2009)164-171
091015WadoodShape-memory NiTi foams produced by replication of NaCl space-holdersA. Bansiddhi, D.C. DunandActa Biomaterialia4(2008)1996-2007
091029‘–ì‘×GSerrated flow behavior in a near alpha titanium alloy IMI834Kartik Prasad, Vijay.K. VarmaMaterials Science and EngineeringA486(2008)158-166
091029·“c’q•FAnalytical modeling of transient liquid phase (TLP) diffusion bonding when a temperature gradient is imposedA.A. Shirzadi, E.R. WallachActa MaterialiaVol.47 No.13(1999)3551-3560
091029‹g“c“W”VFormation, microstructure and properties of long-period order structure reinforced Mg-based bulk metallic glass compositesX. Hui, W. Dong, G.L. Chen, K.F. YaoActa Materialia55(2007)907-920
091105‰œ–쌳‹MSelf-diffusion in Ni_2MnGaG. Erdélyi, H. Mehrer, A.W. Imre, T.A. Lograsso, D.L. SchlagelIntermetallics15(2007)1078-1083
091105]茛‘¾Microstructural investigation of the volume beneath nanoindentations in copperM. Rester, C. Motz, R. PippanActa Materialia55(2007)6427-6435
091105–¼‰z‹MŽuEffect of grain orientation on deformation structure in cold-rolled polycrystalline aluminiumQ.LIU, D.JUUL JENSEN, N.HANSENActa MaterialiaVol.46, Issue 16(1998)5819-5838
091112•i“cŠG—¢Influence of initial microstructure and impurities on Cu room-temperature recrystallization (self-annealing)M. Stangl, M. LiptaLk, A. Fletcher, J. Acker, J. Thomas, H. Wendrock, S. Oswald, K. WetzigMicroelectronic Engineering85(2008)534–541
091112“cèr˜aSome critical experiments on the strain-rate sensitivity of nanocrystalline nickelR. Schwaiger, B. Moser, M. Dao, N. Chollacoop and S. SureshActa Materialia51(2003)5159–5172
091112“‚‘ò—CˆObservation of twin boundary migration in copper during deformationD.P. Field, B.W. True, T.M. Lillo, J.E. FlinnMaterials Science and EngineeringA372(2004)173–179
091112Mark Chang----
091117’ç‘Combinatorial studies of mechanical properties of Ti-Al thin films using nanoidentationSeung Min Han,R.Shah,R.BenerjeeActa Materialia53(2005)2059-2067
091117Œã“¡ÍmDeformation and annealing of (001)[01-1]oriented Al single crystalsN.Stanford,D.Dunne,M.FerryActa Materialia51(2003)665-676
091117’¾Œ¼•áA simple dislocation model of deformation resistance of ultrafine-grain materials explaining Hall-Petch@strengthening and enhanced strain rate sensitivityW.Blun,X.H.ZengActa Materialia57(2009)1966-1974
091124Abdul WadoodAging response of coarse and fine grained beta(ƒÀ)titanium alloysO.M.Ivasishin,P.E.Markovsky S.L.SemiatinMaterial science and engineering405(2005)296-305
091124·“c’q•FTransient liquid phase diffusion bonding under a temperature gradient:Modeling of the interface morphologyAssadi .H,Shirzadi A.A and Wallach.E.RActa Materialia49(2001)31-39
091124‹g“c“W”VIn situ formed two-phase metallic glass with surface fractal microstructureA.A.Kunding,M.Ohnuma,D.H.Ping,T.Ohnuki,K.HonoActa Materialia52(2004)2441-2448
091203‰œ–쌳‹MDeformation twinnning in NiMnGa micropillars with 10M martensiteM.Reinhold,D.Kiener,W.B.Knowlton,G.Dehm,P.MullnerJournal of Applied Physics106(2009)053906,1-6
091203]茛‘¾Tempering effects on three martensitic carbon steels studies by mechanical spectroscopyR.Martin,I.Tkalces,D.Mari and R.SchallerPhilosophical Magazine vol88,No.22(2008),2907-2920
091203–¼‰z‹MŽuExperimentally determined content of s geometrically necessary dislocation boundary in copperRodney J,Mccabe,Amit Misra,Terence E.MitchellActa Materialia53(2003)705-714
091210•i“cŠG—¢Recrystallization kinettics of electroplated Cu in damascence trencches at room temperatureC.Lingk and M.E.GrossJournal of Applied Physics84(1998)
091210“cèr˜aSize-effected single-slip behavior of pure nickel microcrystalaD.M.Dimiduk,M.D.Uchic,T.A.ParthasaranthyActa Materialia53(2005)4065-4077
091217“‚‘ò—SˆNano-sized twin induced high rate sensitivity of flow stress in pure copperL.Liu,R.Schwaiger,Z.W.Shan,M.Dao,K.Lu,S,SureshActa Materialia53(2005)2169-2179
091217“àŽR_вLocalized electroless deposition of gold nanoparticles using scanning electrochemical microscopyE.Malel and D.MandlerJournal of the electrochemical society(2008)155(6),D459-D467
091217Mark ChangVertically oriented TiO2 nanotube arrays growth on Ti meshes for flexible Dye-Sensitized solar cellsZhaoyue Liu,Vaidyanathan Subramania,and Mano MasraJournal of Phisical Chemistry C113(2009)14028-14003
091217´…“N–çPlanarization efficiency of electrochemical mechanical deposition and its dependence on process parameterBulent M.Basqol,Serkan Erdemli,Cyprian E.Uzoh,and Tony WangJournal of electrochemical society153(3)C176-C181(2006)
100114’¾Œ¼•áPlastic deformation anfd fracture of ultrafine-grained Al-Mg alooys with a bimodal grain size distributionG.J Fan H.Choo,P.K.Liaw,E.J LaverniaActa Materialia54(2006)1759-1766
100114’†•½—DˆêSolute strengthening of both mobile and forest dislocation:The orgin of dynamic strain aging of fccM.A.Soare,W.A.CurtinActa Materialia56(2008)4046-4061